© 2007 Microchip Technology Inc.

DS20090C-page 35

MCP23016

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information (e.g., on pricing or delivery) refer to the factory or the listed sales office.

PART NO.

X

/XX

Package

Temperature

Range

Device

Device:

Temperature

Range:

I= -40

°C to +85°C

Package:

SP = Plastic DIP (300 mil Body), 28-lead

SO = Plastic SOIC, Wide (300 mil Body), 28-lead

SS = Plastic SOIC, (209 mil, 5.30mm), 28-lead

ML = Plastic Quad, Flat No Leads (QFN), 28-lead

Examples:

a)

DSTEMP-I/P:

Industrial Temperature,

PDIP package.

a)

DSTEMP-I/SO:

Industrial Temperature,

SOIC package.

a)

DSTEMP-I/SS:

Industrial Temperature,

SOIC package.

a)

DSTEMP-I/ML:

Industrial Temperature,

QFN package.