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24LC64-E/ST 数据表(PDF) 13 Page - Microchip Technology |
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24LC64-E/ST 数据表(HTML) 13 Page - Microchip Technology |
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13 / 24 page ![]() 2002 Microchip Technology Inc. DS21189F-page 13 24AA64/24LC64 8.0 PACKAGING INFORMATION 8.1 Package Marking Information XXXXXXXX XXXXXNNN YYWW 8-Lead PDIP (300 mil) Example: 8-Lead SOIC (150 mil) Example: XXXXXXXX XXXXYYWW NNN 8-Lead TSSOP Example: 24LC64 I/PNNN YYWW 24LC64 I/SNYYWW NNN XXXX XYWW NNN 4LB IYWW NNN Legend: XX...X Customer specific information* YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. 8-Lead MSOP Example: XXXXXX YWWNNN 4L64I YWWNNN 8-Lead SOIC (208 mil) Example: XXXXXXXX XXXXXXXX YYWWNNN 24LC64 I/SM YYWWNNN Rotated TSSOP marking will be “4LBX” |
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