TS613

4/10

THERMAL INFORMATION

The TS613 is housed in an Exposed-Pad plastic

package. As described on the figures below, this

package uses a leadframe upon which the dice is

mounted. This leadframe is exposed as a thermal

pad on the underside of the package. The thermal

contact is direct with the dice. This thermal path

provide an excellent thermal performance.

The thermal pad is electrically isolated from all

pins in the package. It can also be soldered to a

copper area of the PCB underneath the package.

Through these thermal paths within this copper ar-

ea, heat can be conducted away from the pack-

age. In this case, the copper area must be con-

nected to (-Vcc)

INTERMODULATION DISTORTION

The curves shown below are the measurements

results of a single operator wired as an adder with

a gain of 15dB.

The operational amplifier is supplied by a symmet-

ric

±6V and is loaded with 25Ω.

Two synthesizers (Rhode & Schwartz SME) gen-

erate two frequencies (tones) (70 & 80kHz ; 180 &

280kHz).

An HP3585 spectrum analyzer measures the spu-

rious level at different frequencies.

The curves are traced for different output levels

(the value in the X ax is the value of each tone).

The output levels of the two tones are the same.

The generators and spectrum analyzer are phase

locked to enhance measurement precision.

3rd ORDER INTERMODULATION

Gain=15dB, Vcc=

80kHz

2nd ORDER INTERMODULATION

Gain=15dB, Vcc=

280kHz, Spurious measurement @100kHz

3rd ORDER INTERMODULATION

Gain=15dB, Vcc=

280kHz

Cross Section View

DICE

Bottom View

Side View

1

1,5

2

2,5

3

3,5

4

4,5

-100

-90

-80

-70

-60

-50

-40

-30

-20

-10

0

Vout peak (V)

230kHz

220kHz

90kHz

60kHz

Vout peak (V)

1,5

2

2,5

3

3,5

4

4,5

-70

-65

-60

-55

1

1,522,533,5

4

4,5

-100

-90

-80

-70

-60

-50

-40

-30

-20

-10

0

Vout peak (V)

80kHz

640kHz

380kHz

740kHz