9

Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,

depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product

status are available at: www.st.com. ECOPACK is an ST trademark.

9.1

Packing

Tested dice are delivered as sawn dice which are reconstructed into a wafer format on UV-tape, and delivered on

a metallic ring (see figure below). The frames are packed in plastic containers, each including a maximum of 13

double-spaced reconstructed wafer rings. A mapping information file is also provided for localizing dice that may

have been damaged during wafer reconstruction on sticking foil.

Figure 21. Reconstructed wafer information

VD66GY

Package information

DS13838 - Rev 7

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