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VNF9D5F 数据表(PDF) 92 Page - STMicroelectronics |
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VNF9D5F 数据表(HTML) 92 Page - STMicroelectronics |
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92 / 106 page ![]() Figure 47. QFN 6x6 thermal impedance junction ambient 101 100 102 10-4 10-3 10-2 103 10-1 100 101 102 Time (s) ZthJA (°C/W) Cu = footprint Cu = 2 cm2 Cu = 8 cm2 4 layer Zthδ = Rth · δ + Ztht p (1 - δ) where δ = tP/T Figure 48. Thermal fitting model PdCh1 PdCh2 TJ TJ R1 R2 R3 R4 R5 R6 R7 R8 C1 C2 C3 C4 C5 C6 C7 C8 GAPGCFT00438 Note: The fitting model is a simplified thermal tool and is valid for transient evolutions where the embedded protections (power limitation or thermal cycling during thermal shutdown) are not triggered. VNF9D5F Package and PCB thermal data DS13946 - Rev 6 page 92/106 |
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