TC2055 datasheet(2/18 Pages) MICROCHIP

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TC2054/2055/2186

DS21663C-page 2

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

Input Voltage .........................................................6.5V

Output Voltage................................(-0.3) to (VIN + 0.3)

Operating Temperature .................. -40°C < TJ< 125°C

Storage Temperature..........................-65°C to +150°C

Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V

† Notice: Stresses above those listed under “Absolute

Maximum Ratings” may cause permanent damage to

the device. These are stress ratings only and functional

operation of the device at these or any other conditions

above those indicated in the operation sections of the

specifications is not implied. Exposure to Absolute

Maximum Rating conditions for extended periods my

affect device reliability.

ELECTRICAL SPECIFICATIONS

Electrical Specifications: Unless otherwise noted, VIN = VR + 1V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.

BOLDFACE type specifications apply for junction temperature of -40°C to +125°C.

Parameter

Sym

Min

Typ

Max

Units

Conditions

Input Operating Voltage

VIN

2.7

—

6.0

Note 1

Maximum Output Current

IOUTMAX

100

150

—

TC2054

TC2055

TC2186

Output Voltage

VOUT

VR - 2.0% VR ± 0.4% VR + 2.0%

Note 2

VOUT Temperature

Coefficient

TCVOUT

—

ppm/°C Note 3

Line Regulation

ΔVOUT/

ΔVIN

—0.05

0.5

%(VR + 1V) < VIN < 6V

Load Regulation

ΔVOUT/

VOUT

-1.5

-2.5

0.5

TC2054;TC2055IL = 0.1 mA to IOUTMAX

TC2186

IL = 0.1 mA to IOUTMAX

Note 4

Dropout Voltage, Note 5

VIN – VOUT

—

140

—

140

210

IL = 100 µA

IL = 50 mA

TC2015; TC2185 IL = 100 mA

TC2185

IL = 150 mA

Note 5

Supply Current

IIN

—55

µA

SHDN = VIH, IL=0

Shutdown Supply Current

IINSD

—

0.05

0.5

µA

SHDN = 0V

Power Supply Rejection

Ratio

PSRR

—

FRE ≤ 100 kHz

Output Short Circuit Current

IOUTSC

160

300

—

VOUT = 0V

Thermal Regulation

ΔVOUT/ΔPD

—0.04

—

V/W

Note 6

Thermal Shutdown Die

Temperature

TSD

—

160

—

°C

Note 1: The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT.

2: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V.

3: TCVOUT =

4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested

over a load range from 1.0mA to the maximum specified output current. Changes in output voltage due to heating

effects are covered by the thermal regulation specification.

5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value

at a 1V differential.

6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,

excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10 ms.

7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem-

perature and the thermal resistance from junction-to-air (i.e. TA, TJ, θJA).

8: Hysteresis voltage is referenced by VR.

Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN.

VOUTMAX VOUTMIN

–

() 10

VOUT ΔT

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