AD9858

Rev. C | Page 29 of 32

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD

1

25

26

50

76

100

75

51

14.00 BSC SQ

16.00 BSC SQ

0.27

0.22

0.17

0.50 BSC

1.05

1.00

0.95

0.15

0.05

0.75

0.60

0.45

SEATING

PLANE

1.20

MAX

1

25

26

50

76

100

75

51

6.50

NOM

7°

3.5°

0°

COPLANARITY

0.08

0.20

0.09

TOP VIEW

(PINS DOWN)

BOTTOM VIEW

(PINS UP)

CONDUCTIVE

HEAT SINK

PIN 1

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 40. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]

(SV-100-1)

Dimensions shown in millimeters

WARNING

The TQFP_EP (thermal slug) must be attached to the ground plane or some other large metal mass for thermal transfer. Failure to do so

may cause excessive die temperature rise and damage to the device.

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

AD9858BSV

–40°C to +85°C

100-Lead TQFP_EP

SV-100-1

AD9858BSVZ1

–40°C to +85°C

100-Lead TQFP_EP

SV-100-1

AD9858/PCBZ1

Generic Evaluation Board

AD9858/FDPCB

Fractional Divide Evaluation Board

AD9858/TLPCBZ1

Translation Loop Evaluation Board

1 Z = RoHS Compliant Part.