MCP1406/07

DS22019A-page 14

© 2006 Microchip Technology Inc.

8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S]

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Number of Pins

Pitch

Overall Height

Standoff

Contact Thickness

Overall Length

Overall Width

Exposed Pad Length

Exposed Pad Width

Contact Width

Contact Length §

Contact-to-Exposed Pad §

Units

Dimension Limits

N

e

A

A1

A3

D

E

D2

E2

b

L

K

0.80

0.00

3.90

2.20

0.35

0.50

0.20

8

1.27 BSC

0.85

0.01

0.20 REF

5.00 BSC

6.00 BSC

4.00

2.30

0.40

0.60

—

1.00

0.05

4.10

2.40

0.48

0.75

—

MIN

NOM

MAX

MILLIMETERS

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package may have one or more exposed tie bars at ends.

3. § Significant Characteristic

4. Package is saw singulated

5. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing No. C04–122, Sept. 8, 2006

TOP VIEW

BOTTOM VIEW

NOTE 1

EXPOSED PAD

1

2

E

A3

A1

A

NOTE 2

N

D

NOTE 1

E2

b

e

L

N

D2

2

1

K