DS22001C-page 23

MCP1827/MCP1827S

3-Lead Plastic (EB) [DDPAK]

Notes:

1. § Significant Characteristic.

2. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

INCHES

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

3

Pitch

e

.100 BSC

Overall Height

A

.160

–

.190

Standoff §

A1

.000

–

.010

Overall Width

E

.380

–

.420

Exposed Pad Width

E1

.245

–

–

Molded Package Length

D

.330

–

.380

Overall Length

H

.549

–

.625

Exposed Pad Length

D1

.270

–

–

Lead Thickness

c

.014

–

.029

Pad Thickness

C2

.045

–

.065

Lower Lead Width

b

.020

–

.039

Upper Lead Width

b1

.045

–

.070

Foot Length

L

.068

–

.110

Pad Length

L1

–

–

.067

Foot Angle

φ

0°

–

8°

E

E1

H

L1

D

D1

N

1

e

b

b1

c

C2

L

A

A1

BOTTOM VIEW

TOP VIEW

CHAMFER

OPTIONAL

φ

Microchip Technology Drawing C04-011B