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93C46AX-E/ST 数据表(PDF) 20 Page - Microchip Technology |
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93C46AX-E/ST 数据表(HTML) 20 Page - Microchip Technology |
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20 / 28 page ![]() 93AA46A/B/C, 93LC46A/B/C, 93C46A/B/C DS21749F-page 20 © 2005 Microchip Technology Inc. 8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated Exposed Pad Width Exposed Pad Length Contact Length *Controlling Parameter Contact Width Drawing No. C04-123 Notes: Exposed pad dimensions vary with paddle size. Overall Width E2 D2 L b E .016 .012 .008 .047 .055 .010 .118 BSC Number of Pins Standoff Contact Thickness Overall Length Overall Height Pitch p n Units A A1 D A3 Dimension Limits 8 .000 .001 .008 REF. .079 BSC .031 .020 BSC MIN INCHES NOM 0.40 0.25 3.00 BSC 0.30 .020 .071 .012 .064 0.20 1.20 1.39 0.50 0.30 1.80 1.62 0.02 0.80 2.00 BSC 0.20 REF. 0.50 BSC MILLIMETERS* .002 .039 0.00 MIN MAX NOM 8 0.05 1.00 MAX 3. Package may have one or more exposed tie bars at ends. 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. 0.90 .035 (Note 3) (Note 3) 4. JEDEC equivalent: MO-229 L E2 A3 A1 A TOP VIEW D E EXPOSED PAD METAL D2 BOTTOM VIEW 21 b p n (NOTE 1) EXPOSED TIE BAR PIN 1 (NOTE 2) ID INDEX AREA Revised 05/24/04 -- -- -- -- |
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