AD8392A

Data Sheet

Rev. A | Page 4 of 12

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage

±13 V (+26 V)

Power Dissipation

See Figure 3

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, θJA is specified

for the device soldered in the circuit board for surface-mount

packages.

Table 3.

Package Type

θJA

Unit

LFCSP-32 (CP)

27.27

°C/W

TSSOP_EP (RE)

35.33

°C/W

Maximum Power Dissipation

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

power is the voltage between the supply pins (VS) times the

quiescent current (IS). Assuming that the load (RL) is midsupply,

the total drive power is VS/2 × IOUT, some of which is dissipated

in the package and some in the load (VOUT × IOUT).

RMS output voltages should be considered. If RL is referenced to

VS− as in single-supply operation, the total power is VS × IOUT.

In single supply with RL to VS−, worst case is VOUT = VS/2.

Airflow increases heat dissipation, effectively reducing θJA. In

addition, more metal directly in contact with the package leads

from metal traces, through holes, ground, and power planes

reduces the θJA.

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the LFCSP-32 and

TSSOP_EP packages on a JEDEC standard 4-layer board.

θJA values are approximations.

0

1

2

3

4

5

6

7

–40 –30 –20 –10

0

10

20

30

40

50

60

70

80

90

TEMPERATURE (°C)

TJ = 150°C

LFCSP-32

TSSOP-28/EP

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

See the Thermal Considerations section for additional thermal

design guidance.

ESD CAUTION