ADA4431-1

Rev. 0 | Page 5 of 12

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

4.0 V

Power Dissipation

See Figure 3

Storage Temperature Range

–65°C to +125°C

Operating Temperature Range

–40°C to +85°C

Lead Temperature (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

to a high thermal conductivity 2s2p circuit board, as described

in EIA/JESD 51-7. The exposed pad is not electrically connected to

the device. It is typically soldered to a pad on the PCB that is

thermally and electrically connected to an internal ground plane.

Table 4. Thermal Resistance

Package Type

Unit

16-lead LFCSP-UQ (CP-16-12)

43

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation in the ADA4431-1

package is limited by the associated rise in junction temperature

transition temperature, the plastic changes its properties. Even

temporarily exceeding this temperature limit can change the

stresses that the package exerts on the die, permanently shifting

the parametric performance of the ADA4431-1. Exceeding a

junction temperature of 150°C for an extended period can result in

changes in the silicon devices potentially causing failure.

quiescent power dissipation and the power dissipated in the

package due to the load drive. The quiescent power is the voltage

The power dissipated due to the load drive depends upon the

particular application. The power due to load drive is calculated

by multiplying the load current by the associated voltage drop

across the device. RMS voltages and currents must be used in

these calculations.

addition, more metal directly in contact with the package leads

and exposed pad from metal traces, through-holes, ground, and

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 16-lead LFCSP

package (43°C/W) on a JEDEC standard 4-layer board.

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

–40 –30 –20 –10

0

10 20 30

40 50 60

70 80 90 100

AMBIENT TEMPERATURE (°C)

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION