© 2007 Microchip Technology Inc.

Preliminary

DS21836D-page 21

25AA1024/25LC1024

8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]

PUNCH SINGULATED

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Package may have one or more exposed tie bars at ends.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

8

Pitch

e

1.27 BSC

Overall Height

A

–

0.85

1.00

Molded Package Thickness

A2

–

0.65

0.80

Standoff

A1

0.00

0.01

0.05

Base Thickness

A3

0.20 REF

Overall Length

D

4.92 BSC

Molded Package Length

D1

4.67 BSC

Exposed Pad Length

D2

3.85

4.00

4.15

Overall Width

E

5.99 BSC

Molded Package Width

E1

5.74 BSC

Exposed Pad Width

E2

2.16

2.31

2.46

Contact Width

b

0.35

0.40

0.47

Contact Length

L

0.50

0.60

0.75

Contact-to-Exposed Pad

K

0.20

–

–

Model Draft Angle Top

φ

–

–

12°

φ

NOTE 2

A3

A2

A1

A

NOTE 1

NOTE 1

EXPOSED

PAD

BOTTOM VIEW

1

2

D2

2

1

E2

K

L

N

e

b

E

E1

D

D1

N

TOP VIEW

Microchip Technology Drawing C04-113B