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TDA9178 数据表(PDF) 31 Page - NXP Semiconductors |
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TDA9178 数据表(HTML) 31 Page - NXP Semiconductors |
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31 / 36 page ![]() 1999 Sep 24 31 Philips Semiconductors Preliminary specification YUV one chip picture improvement based on luminance vector-, colour vector- and spectral processor TDA9178 PACKAGE OUTLINES UNIT b1 cE e MH L REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm DIMENSIONS (mm are the original dimensions) SOT234-1 92-11-17 95-02-04 b max. w M E e 1 1.3 0.8 0.53 0.40 0.32 0.23 22.3 21.4 9.1 8.7 3.2 2.8 0.18 1.778 10.16 10.7 10.2 12.2 10.5 1.6 4.7 0.51 3.8 MH c (e ) 1 ME A L A1 w M b1 e D A2 Z 24 1 13 12 b E pin 1 index 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. (1) (1) D (1) Z A max. 12 A min. A max. SDIP24: plastic shrink dual in-line package; 24 leads (400 mil) SOT234-1 |
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