Data Sheet

ADA4922-1

Rev. A | Page 19 of 19

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MS-012-A A

1.27

0.40

1.75

1.35

2.29

2.29

0.356

0.457

4.00

3.90

3.80

6.20

6.00

5.80

5.00

4.90

4.80

0.10 MAX

0.05 NOM

3.81 REF

0.25

0.17

8°

0°

0.50

0.25

45°

COPLANARITY

0.10

1.04 REF

8

1

4

5

1.27 BSC

SEATING

PLANE

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

BOTTOM VIEW

TOP VIEW

0.51

0.31

1.65

1.25

Figure 51. 8-Lead Standard Small Outline Package with Exposed Pad [SOIC_N_EP]

Narrow Body

(RD-8-1)

Dimensions shown in millimeters

TOP VIEW

8

1

5

4

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.55

1.45

1.35

1.84

1.74

1.64

0.203 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-WEED

PIN 1

INDICATOR

(R 0.15)

Figure 52. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-8-13)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package

Option

Branding

ADA4922-1ARDZ

–40°C to +85°C

8-Lead Standard Small Outline Package with Exposed Pad [SOIC_N_EP]

RD-8-1

ADA4922-1ARDZ-RL

–40°C to +85°C

8-Lead Standard Small Outline Package with Exposed Pad [SOIC_N_EP]

RD-8-1

ADA4922-1ACPZ-R2

–40°C to +85°C

8-Lead Lead Frame Chip Scale Package [LFCSP]

CP-8-13

HUB

ADA4922-1ACPZ-RL7

–40°C to +85°C

8-Lead Lead Frame Chip Scale Package [LFCSP]

CP-8-13

HUB

ADA4922-1ACP-EBZ

Evaluation Board

1 Z = RoHS-Compliant Part.

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registered trademarks are the property of their respective owners.

D05681-0-5/16(A)