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ADA4077-2BRZ-R7 数据表(PDF) 6 Page - Analog Devices |
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ADA4077-2BRZ-R7 数据表(HTML) 6 Page - Analog Devices |
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6 / 25 page ![]() Data Sheet ADA4077-1/ADA4077-2/ADA4077-4 ABSOLUTE MAXIMUM RATINGS analog.com Rev. F | 6 of 25 Table 4. Parameter Rating Supply Voltage 36 V Input Voltage ±VSY Input Current1 ±10 mA Differential Input Voltage ±VSY Output Short-Circuit Duration to GND Indefinite Storage Temperature Range −65°C to +150°C Operating Temperature Range −40°C to +125°C Junction Temperature Range −65°C to +150°C Maximum Reflow Temperature (MSL1 Rating)2 260°C Lead Temperature, Soldering (10 sec) 300°C Electrostatic Discharge (ESD) Human Body Model (HBM)3 6 kV Field Induced Charge Device Model (FICDM)4 1.25 kV 1 The input pins have clamp diodes to the power supply pins and to each other. Limit the input current to 10 mA or less whenever input signals exceed the power supply rail by 0.3 V. 2 IPC/JEDEC J-STD-020 applicable standard 3 ESDA/JEDEC JS-001-2011 applicable standard. 4 JESD22-C101 (ESD FICDM standard of JEDEC) applicable standard. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operat- ing conditions for extended periods may affect product reliability. THERMAL RESISTANCE θJA is specified for the worst case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 5. Thermal Resistance Package Type θJA θJC Unit 8-Lead MSOP 190 44 °C/W 8-Lead SOIC 158 43 °C/W 14-Lead TSSOP 240 43 °C/W 14-Lead SOIC 115 36 °C/W ESD CAUTION ESD (electrostatic discharge) sensitive device. Charged devi- ces and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality. |
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