Data Sheet

AD8000

Rev. C | Page 17 of 17

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MS-012-A A

1.27

0.40

1.75

1.35

2.29

2.29

0.356

0.457

4.00

3.90

3.80

6.20

6.00

5.80

5.00

4.90

4.80

0.10 MAX

0.05 NOM

3.81 REF

0.25

0.17

8°

0°

0.50

0.25

45°

COPLANARITY

0.10

1.04 REF

8

1

4

5

1.27 BSC

SEATING

PLANE

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

BOTTOM VIEW

TOP VIEW

0.51

0.31

1.65

1.25

Figure 54. 8-Lead Standard Small Outline Package, with Exposed Pad [SOIC_N_EP]

Narrow Body

(RD-8-1)

Dimensions shown in millimeters

TOP VIEW

8

1

5

4

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

SEATING

PLANE

0.80

0.75

0.70

1.55

1.45

1.35

1.84

1.74

1.64

0.203 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

3.10

3.00 SQ

2.90

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COPLANARITY

0.08

0.50

0.40

0.30

COMPLIANT

TO JEDEC STANDARDS MO-229-WEED

PIN 1

INDICATOR

(R 0.15)

Figure 55. 8-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-8-13)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

Branding

Ordering Quantity

AD8000YRDZ

–40°C to +125°C

8-Lead SOIC_N_EP

RD-8-1

1

AD8000YRDZ-REEL7

–40°C to +125°C

8-Lead SOIC_N_EP

RD-8-1

1,000

AD8000YCPZ-R2

–40°C to +125°C

8-Lead LFCSP

CP-8-13

HNB

250

AD8000YCPZ-REEL

–40°C to +125°C

8-Lead LFCSP

CP-8-13

HNB

5,000

AD8000YCPZ-REEL7

–40°C to +125°C

8-Lead LFCSP

CP-8-13

HNB

1,500

1 Z = RoHS Compliant Part.

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D05321-0-5/16(C)