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M41T56C64 数据表(PDF) 10 Page - STMicroelectronics |
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M41T56C64 数据表(HTML) 10 Page - STMicroelectronics |
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10 / 19 page ![]() Maximum rating M41T56C64 10/19 5 Maximum rating Stressing the device above the rating listed in the “absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE program and other relevant quality documents. Caution: Negative undershoots below –0.3V are not allowed on any pin while in the battery back-up mode. Table 3. Absolute maximum ratings Symbol Parameter Value Unit TA Ambient operating temperature –40 to 85 °C TSTG Storage temperature (VCC off, oscillator off) –55 to 125 °C TSLD (1) 1. For SOX18 package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 240°C (total thermal budget not to exceed 180°C for between 90 to 150 seconds). No direct exposure to infrared (IR) reflow, or IR preheat allowed, to avoid damaging the embedded 32KHz crystal. Lead solder temperature for 10 seconds 240 °C VIO Input or output voltages –0.3 to 6.5 V VCC Supply voltage –0.3 to 6.5 V IO Output current 20 mA PD Power dissipation 0.25 W |
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