KPCSLMM1.F1 datasheet(1/25 Pages) OSRAM | Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

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KPCSLMM1.F1 数据表(PDF) 1 Page - OSRAM GmbH

部件名	KPCSLMM1.F1

功能描述	Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

PDF	25 Pages

Scroll/Zoom	100%

制造商	OSRAM [OSRAM GmbH]

网页	http://www.osram.com

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KPCSLMM1.F1 数据表(HTML) 1 Page - OSRAM GmbH

KPCSLMM1.F1 Datasheet HTML 1Page - OSRAM GmbH

KPCSLMM1.F1 Datasheet HTML 2Page - OSRAM GmbH

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KP CSLMM1.F1

DATASHEET

DATASHEET

1 | Version 1.1 | 2024-06-05

www.osram-os.com

KP CSLMM1.F1

Datasheet

Published by ams-OSRAM AG

Tobelbader Strasse 30, 8141 Premstaetten, Austria

Phone +43 3136 500-0

ams-osram.com

© All rights reserved

类似零件编号 - KPCSLMM1.F1

制造商	部件名	数据表	功能描述
OSRAM GmbH	KPCSLMMA.F1	1Mb / 25P	OSRAM OSTAR® Projection Compact Version 1.0 2023-11-14
OSRAM GmbH	KPCSLMMA.F1-5N8N-A-0	1Mb / 25P	OSRAM OSTAR® Projection Compact Version 1.0 2023-11-14

类似说明 - KPCSLMM1.F1

制造商	部件名	数据表	功能描述
CITIZEN ELECTRONICS CO....	CL-473S	92Kb / 1P	LED For Flash Light Source
	CL-597S	95Kb / 1P	LED For Flash Light Source
	CL-473S	296Kb / 1P	LED For Flash Light Source
OSRAM GmbH	LERQ8WP-KBMA-34	786Kb / 23P	Compact light source in SMT technology
	LETQ8WP-MBNB-34	791Kb / 23P	Compact light source in SMT technology
	LETQ9WM-JXKX-25	738Kb / 21P	Compact light source in SMT technology
ams AG	KW2CFLNM3.TK	1Mb / 25P	Compact light source with isolated thermal pad for improved heat dissipation and small z-tolerance (/- 35 μm). Version 1.0 2022-12-14
	KW4CHLNM2.TK	1Mb / 25P	Compact light source with isolated thermal pad for improved heat dissipation and small z-tolerance (/- 35 μm). Version 1.1 2021-09-01
	KWCWLPM3.TK	1Mb / 24P	Compact light source with improved heat dissipation and small z-tolerance (/- 35 μm). Version 1.1 2022-07-21
	KYCSLNM1.FY	1Mb / 21P	Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output. Version 1.1 2020-10-30

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