KYCSLNM1.FY-LBMB-FY-R18 datasheet(14/21 Pages) OSRAM

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KYCSLNM1.FY-LBMB-FY-R18 数据表(PDF) 14 Page - OSRAM GmbH

部件名	KYCSLNM1.FY-LBMB-FY-R18

功能描述	Compact light source with isolated heat sink for improved heat dissipation and high current chip technology for increased light output.

PDF	21 Pages

Scroll/Zoom	100%

制造商	OSRAM [OSRAM GmbH]

网页	http://www.osram.com

标志

14 / 21 page

KY CSLNM1.FY

14 Version 1.1 | 2020-10-30

Recommended Solder Pad 7)

Board selection has high impact on system reliability. For superior solder joint connectivity results we recommend soldering

under standard nitrogen atmosphere. Package not suitable for any kind of wet cleaning or ultrasonic cleaning.

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