June 1994

18

Philips Semiconductors

Product specification

8-bit high-speed analog-to-digital converter

TDF8704

SOLDERING

Plastic small-outline packages

During placement and before soldering, the component

must be fixed with a droplet of adhesive. After curing the

adhesive, the component can be soldered. The adhesive

can be applied by screen printing, pin transfer or syringe

dispensing.

Maximum permissible solder temperature is 260

°C, and

maximum duration of package immersion in solder bath is

10 s, if allowed to cool to less than 150

°C within 6 s.

Typical dwell time is 4 s at 250

°C.

A modified wave soldering technique is recommended

using two solder waves (dual-wave), in which a turbulent

wave with high upward pressure is followed by a smooth

laminar wave. Using a mildly-activated flux eliminates the

need for removal of corrosive residues in most

applications.

Reflow soldering requires the solder paste (a suspension

of fine solder particles, flux and binding agent) to be

applied to the substrate by screen printing, stencilling or

pressure-syringe dispensing before device placement.

Several techniques exist for reflowing; for example,

thermal conduction by heated belt, infrared, and

vapour-phase reflow. Dwell times vary between 50 and

300 s according to method. Typical reflow temperatures

range from 215 to 250

°C.

Preheating is necessary to dry the paste and evaporate

the binding agent. Preheating duration: 45 min at 45

°C.

IRON OR PULSE

Fix the component by first soldering two, diagonally

opposite, end pins. Apply the heating tool to the flat part of

the pin only. Contact time must be limited to 10 s at up to

300

°C. When using proper tools, all other pins can be

soldered in one operation within 2 to 5 s at between 270

and 320

°C. (Pulse-heated soldering is not recommended

for SO packages.)

For pulse-heated solder tool (resistance) soldering of VSO

packages, solder is applied to the substrate by dipping or

by an extra thick tin/lead plating before package

placement.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the specification

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.