Data Sheet

ADA4856-3

Rev. B | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

6 V

Internal Power Dissipation1

See Figure 3

Common-Mode Input Voltage

(−VS − 0.2 V) to (+VS − 1 V)

Differential Input Voltage

±VS

Output Short-Circuit Duration

Observe power curves

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +105°C

Lead Temperature (Soldering, 10 sec)

300°C

1

Specification is for device in free air.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, θJA is specified

for a device soldered in a circuit board for surface-mount packages.

Table 4.

Package Type

θJA

θJC

Unit

16-Lead LFCSP

67

17.5

°C/W

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the

ADA4856-3 is limited by the associated rise in junction

temperature. The maximum safe junction temperature for

plastic encapsulated devices is determined by the glass transition

temperature of the plastic, approximately 150°C. Temporarily

exceeding this limit may cause a shift in parametric performance

due to a change in the stresses exerted on the die by the package.

Exceeding a junction temperature of 175°C for an extended

period can result in device failure.

To ensure proper operation, it is necessary to observe the

maximum power derating curves.

3.0

2.5

2.0

1.5

1.0

0.5

0

AMBIENT TEMPERATURE (°C)

Figure 3. Maximum Power Dissipation vs. Ambient Temperature

ESD CAUTION