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ADA4622-4ACPZ-R7 数据表(PDF) 10 Page - Analog Devices |
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ADA4622-4ACPZ-R7 数据表(HTML) 10 Page - Analog Devices |
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10 / 36 page ![]() Data Sheet ADA4622-1/ADA4622-2/ADA4622-4 ABSOLUTE MAXIMUM RATINGS analog.com Rev. F | 10 of 36 Table 4. Parameter Rating Supply Voltage 36 V Input Voltage (V−) −0.3 V to (V+) +0.2 V Differential Input Voltage 36 V Storage Temperature Range −65°C to +150°C Operating Temperature Range −40°C to +125°C Junction Temperature Range −65°C to +150°C Lead Temperature, Soldering (10 sec) 300°C ESD Rating, Human Body Model (HBM) 4 kV Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operat- ing conditions for extended periods may affect product reliability. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Close attention to PCB thermal design is required. Table 5. Thermal Resistance Package Type1, 2 θJA θJC3 Unit 8-Lead SOIC_N 1-Layer JEDEC Board N/A 63 °C/W 2-Layer JEDEC Board 120 N/A °C/W 8-Lead MSOP 1-Layer JEDEC Board N/A 115 °C/W 2-Layer JEDEC Board 185 N/A °C/W 8-Lead LFCSP 1-Layer JEDEC Board N/A 63 °C/W 2-Layer JEDEC Board 145 N/A °C/W 2-Layer JEDEC Board with 2 × 2 Vias 55 N/A °C/W 5-Lead SOT-23 1-Layer JEDEC Board N/A 82 °C/W 2-Layer JEDEC Board 339 N/A °C/W 14-Lead SOIC_N 1-Layer JEDEC Board N/A 42 °C/W 2-Layer JEDEC Board 72 N/A °C/W 16-Lead, 4 × 4 mm LFCSP 1-Layer JEDEC Board N/A 2.2 °C/W 2-Layer JEDEC Board 48 N/A °C/W 1 Thermal impedance simulated values are based on a JEDEC thermal test board. See JEDEC JESD51. 2 N/A means not applicable. 3 For θJC test, 100 μm thermal interface material (TIM) is used. TIM is assumed to have 3.6 W/mK. ESD CAUTION ESD (electrostatic discharge) sensitive device. Charged devi- ces and circuit boards can discharge without detection. Although this product features patented or proprietary protection circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be taken to avoid performance degradation or loss of functionality. |
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