ADA4311-1

Rev. 0 | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage

13.6 V

Power Dissipation

(TJMAX − TA)/θJA

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress rating

only; functional operation of the device at these or any other

conditions above those indicated in the operational section of

this specification is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

Thermal resistance (θJA) is specified for the worst-case conditions,

that is, θJA is specified for device soldered in circuit board for

surface-mount packages.

Table 3.

Package Type

θJA

Unit

10-Lead MINI_SO_EP

44

°C/W

Maximum Power Dissipation

The maximum safe power dissipation for the ADA4311-1 is

limited by the associated rise in junction temperature (TJ) on

the die. At approximately 150°C, which is the glass transition

temperature, the plastic changes its properties. Even temporarily

exceeding this temperature limit can change the stresses that the

package exerts on the die, permanently shifting the parametric

performance of the amplifiers. Exceeding a junction temperature of

150°C for an extended period can result in changes in silicon

devices, potentially causing degradation or loss of functionality.

Figure 3 shows the maximum safe power dissipation in

the package vs. the ambient temperature for the 10-lead

MINI_SO_EP (44°C/W) on a JEDEC standard 4-layer board.

θJA values are approximations.

AMBIENT TEMPERATURE (°C)

0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

–35

–15

5

25

45

65

85

MINI_SO_EP-10

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION