Data Sheet

ADA4853-1/ADA4853-2/ADA4853-3

Rev. G | Page 19 of 20

3.10

3.00 SQ

2.90

0.30

0.25

0.20

1.65

1.50 SQ

1.45

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

EXPOSED

PAD

PIN 1

INDICATOR

0.50

0.40

0.30

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

0.20 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.80

0.75

0.70

COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION

SECTION OF THIS DATA SHEET.

Figure 54. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

3 mm × 3 mm Body, Very Very Thin Quad

(CP-16-27)

Dimensions shown in millimeters

ORDERING GUIDE

Model1, 2

Temperature

Range

Package Description

Ordering

Quantity

Package

Option

Branding

ADA4853-1AKSZ-R2

−40°C to +85°C

6-Lead Thin Shrink Small Outline Transistor Package (SC70)

250

KS-6

HEC

ADA4853-1AKSZ-R7

−40°C to +85°C

6-Lead Thin Shrink Small Outline Transistor Package (SC70)

3000

KS-6

HEC

ADA4853-1AKSZ-RL

−40°C to +85°C

6-Lead Thin Shrink Small Outline Transistor Package (SC70)

10,000

KS-6

HEC

ADA4853-1AKS-EBZ

Evaluation Board

1

ADA4853-2YCPZ-R2

−40°C to +105°C

16-Lead Lead Frame Chip Scale Package (LFCSP_WQ)

250

CP-16-27

H0H

ADA4853-2YCPZ-RL

−40°C to +105°C

16-Lead Lead Frame Chip Scale Package (LFCSP_WQ)

5000

CP-16-27

H0H

ADA4853-2YCPZ-RL7

−40°C to +105°C

16-Lead Lead Frame Chip Scale Package (LFCSP_WQ)

1500

CP-16-27

H0H

ADA4853-2YCP-EBZ

Evaluation Board

1

ADA4853-3YCPZ-R2

−40°C to +105°C

16-Lead Lead Frame Chip Scale Package (LFCSP_WQ)

250

CP-16-27

H0L

ADA4853-3YCPZ-RL

−40°C to +105°C

16-Lead Lead Frame Chip Scale Package (LFCSP_WQ)

5000

CP-16-27

H0L

ADA4853-3YCPZ-R7

−40°C to +105°C

16-Lead Lead Frame Chip Scale Package (LFCSP_WQ)

1500

CP-16-27

H0L

ADA4853-3WYCPZ-R7

−40°C to +105°C

16-Lead Lead Frame Chip Scale Package (LFCSP_WQ)

1500

CP-16-27

H2H

ADA4853-3YCP-EBZ

Evaluation Board

ADA4853-3YRUZ

−40°C to +105°C

14-Lead Thin Shrink Small Outline Package (TSSOP)

96

RU-14

ADA4853-3YRUZ-RL

−40°C to +105°C

14-Lead Thin Shrink Small Outline Package (TSSOP)

2500

RU-14

ADA4853-3YRUZ-R7

−40°C to +105°C

14-Lead Thin Shrink Small Outline Package (TSSOP)

1000

RU-14

ADA4853-3YRU-EBZ

Evaluation Board

1

1 Z = RoHS Compliant Part.

2 W = Qualified for Automotive Applications.

AUTOMOTIVE PRODUCTS

The ADA4853-3W model is available with controlled manufacturing to support the quality and reliability requirements of automotive

applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers

should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in

automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to

obtain the specific Automotive Reliability reports for these models.