OP281/OP481

Rev. D | Page 6 of 20

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

Supply Voltage

16 V

Input Voltage

GND to VS + 10 V

Differential Input Voltage

±3.5 V

Output Short-Circuit Duration to GND

Indefinite

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Junction Temperature Range

−65°C to +150°C

Lead Temperature Range (Soldering, 60 sec)

300°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

Table 5. Thermal Resistance

Package Type

θJA1

θJC

Unit

8-Lead SOIC (R Suffix)

158

43

°C/W

8-Lead TSSOP (RU Suffix)

240

43

°C/W

14-Lead SOIC (R Suffix)

120

36

°C/W

14-Lead TSSOP (RU Suffix)

240

43

°C/W

1 θJA is specified for the worst-case conditions, that is, θJA is specified for device

soldered in circuit board for TSSOP and SOIC packages.

ESD CAUTION