PA2423L-R datasheet(7/10 Pages) SIGE

7 / 10 page

PA2423L

RangeCharger

TM 2.4 GHz Power Amplifier IC

Final

13-DST-01 Rev 4.0 Jun-14-2006

7 of 10

QA061406

Applications Information

For test and design purposes, SiGe Semiconductor offers an evaluation board for the PA2423L. The order part

number for the evaluation board is PA2423L-EV. The evaluation board is intended to simplify the testing with respect

to RF performance of this power amplifier.

The application note, 13-APP-01 provides the supporting information for using the evaluation board. It contains

information on the schematic, bill of materials and recommended layout for the power amplifier and the input and

output matching networks. To assist in the design process, this layout is available, upon request, in gerber file format.

Using VRAMP

VRAMP is a digital pin used to power-up and power-down the PA2423L in Time Duplex systems such as Bluetooth

1.1. During receive mode, VRAMP voltage is pulled down, PA2423L acts as a 25 dB isolation block between the radio

and the antenna while consuming a modest 1 µA. In transmit mode, VRAMP voltage is pulled to VCC and PA2423L

offers 19 dB to 21 dB of large signal gain. The rise and fall time are in the order of 1-2 µsec.

Using VCTL

VCTL is an analog pin that is designed to control the gain of PA2423L. Applying a voltage between 0 V and VCC will

adjust the gain between -15 dB and 21 dB. Used in combination with a variable drive level to PA2423L, the VCTL

function can greatly optimize the PAE of the system at all four Bluetooth

TM transmitted power levels.

By applying approximately 1.4 V to VCTL, for example, a Class1 radio can be modified to a Class2 radio with the

PA2423L consuming only 15 mA.

By implementing a resistor DAC, the VCTL pin can interface with Bluetooth

TM transceivers offering digital and

programmable outputs.

Package Dimensions

The PA2423L is packaged in a 1.6 mm x 3.0 mm 6 lead QFN package. The underside of the package is an exposed

die-pad structure. This allows for direct soldering to the PCB for enhanced thermal conductivity. The package

dimensions are shown in the drawing below.

Figure 7: PA2423L Package Drawing

PA2423L-R 数据表(PDF) 7 Page - SiGe Semiconductor, Inc.