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ADA4899-1YCPZ-R2 数据表(PDF) 17 Page - Analog Devices |
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ADA4899-1YCPZ-R2 数据表(HTML) 17 Page - Analog Devices |
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17 / 20 page ![]() Data Sheet ADA4899-1 Rev. C | Page 17 of 20 Grounding Use ground and power planes where possible. Ground and power planes reduce the resistance and inductance of the power planes and ground returns. The returns for the input, output terminations, bypass capacitors, and RG should all be kept as close to the ADA4899-1 as possible. The output load ground and the bypass capacitor grounds should be returned to the same point on the ground plane to minimize parasitic trace inductance, ringing, and overshoot and to improve distortion performance. The ADA4899-1 packages feature an exposed paddle. For optimum electrical and thermal performance, solder this paddle to ground. For more information on high speed circuit design, see A Practical Guide to High-Speed Printed-Circuit- Board Layout. |
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