4. Soldering Profile

Reflow Soldering Conditions/ Profile

(1) Lead Solder

-Preliminary heating to be at 150℃max. for 2 minutes max.

-Soldering heat to be at 240℃max. for 5 seconds max.

Temperature

rise: 5°C/sec.

-5°C/sec.

Cooling:

Pre-heating

Operation heating

60 to 120 sec.

5sec. max

120

150

240

°C

0

(2) Lead Free Solder

-Preliminary heating to be at 150℃max. for 2 minutes max.

-Soldering heat to be at 260℃max. for 10 seconds max.

120

60 to 120 sec.

0

150

°C

Pre-heating

rise: 5°C/sec.

Temperature

Operation heating

-5°C/sec.

Cooling:

260

10 sec.

(3) Hand Soldering conditions

-Not more than 3 seconds @MAX280℃, under Soldering iron.

SEOUL SEMICONDUCTOR CO,. LTD.

148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea

TEL: 82-2-3281-6269 FAX: 82-2-858-5537

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SSC-THBTGFR422

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