Data Sheet

AD8601/AD8602/AD8604

Rev. I | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

6 V

Input Voltage

GND to VS

Differential Input Voltage

±6 V

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

−40°C to +125°C

Junction Temperature Range

−65°C to +150°C

Lead Temperature Range (Soldering, 60 sec)

300°C

ESD

2 kV HBM

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these or

any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for worst-case conditions, that is, a device

soldered onto a circuit board for surface-mount packages using

a standard 4-layer board.

Table 4. Thermal Resistance

Package Type

θJA

θJC

Unit

5-Lead SOT-23 (RJ)

190

92

°C/W

8-Lead SOIC (R)

120

45

°C/W

8-Lead MSOP (RM)

142

45

°C/W

14-Lead SOIC (R)

115

36

°C/W

14-Lead TSSOP (RU)

112

35

°C/W

16-Lead QSOP (RQ)

115

36

°C/W

ESD CAUTION