OP184/OP284/OP484

Rev. J | Page 6 of 24

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Supply Voltage

±18 V

Input Voltage

±18 V

Differential Input Voltage1

±0.6 V

Output Short-Circuit Duration to GND

Indefinite

Storage Temperature Range

P-Suffix, S-Suffix Packages

−65°C to +150°C

Operating Temperature Range

OP184/OP284/OP484E/OP484F

−40°C to +125°C

Junction Temperature Range

P-Suffix, S-Suffix Packages

−65°C to +150°C

Lead Temperature

(Soldering 60 sec)

300°C

1

For input voltages greater than 0.6 V, the input current should be limited to

less than 5 mA to prevent degradation or destruction of the input devices.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply to both DICE and packaged

parts, unless otherwise noted.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions; that is, θJA is

specified for a device in socket for PDIP. θJA is specified for a

device soldered in the circuit board for SOIC packages.

Table 6. Thermal Resistance

Package Type

θJA

θJC

Unit

8-Lead PDIP (P-Suffix)

103

43

°C/W

8-Lead SOIC (S-Suffix)

158

43

°C/W

14-Lead PDIP (P-Suffix)

83

39

°C/W

14-Lead SOIC (S-Suffix)

92

27

°C/W

ESD CAUTION

R3

Q1

–IN

+IN

QL1

QL2

Q4

Q3

Q2

QB5

QB6

RB2

QB3

R1

Q5

R2

QB4

JB2

QB1

N+

CB1

P+

M

QB2

CC1

Q9

Q7

Q11

Q8

Q6

Q10

Q12

QB7

QB8

QB9

RB1

JB1

TP

R4

R5

R6

RB3

FF

C

R7

R8

Q13

Q14

R10

Q15

RB4

QB10

CC2

C O

Q17

Q16

R11

Q18

VCC

OUT

VEE

R9

Figure 4. Simplified Schematic