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SML150MAT12 数据表(PDF) 3 Page - Seme LAB |
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SML150MAT12 数据表(HTML) 3 Page - Seme LAB |
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3 / 8 page ![]() SML150MAT12 Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use. Semelab encourages customers to verify that datasheets are current before placing orders Document No : Issue : ENG/06 Telephone +44(0)1455 556565Fax +44(0)1455 552612 E-mail: sales@semelab.com Web: http://www.semelab.com Mechanical And Thermal Properties Symbol Name Conditions min. typ. max. Unit RthJC Thermal Resistance Junction to Case per IGBT per Diode - - 0.10 0.17 - - °CW -1 °CW -1 RthCK Thermal Resistance Case to Heatsink per module 1 - - 0.01 °CW -1 M Mounting Torque module mounting screw terminals TBA TBA - - TBA TBA Nm Nm W Module Weight - TBA - g 1 thermal grease, planar heat-sink |
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