Data Sheet

ADL8141S

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 5 of 8

Table 6. Absolute Maximum Ratings

Parameter

Rating

VDD

4 V

RFIN Power

20 dBm

Pulsed RFIN (Duty Cycle = 10%, Pulse Width = 100 μs) 22 dBm

Continuous Power Dissipation (PDISS), TCASE = 85°C

(Derate 5.71 mW/°C Above 85°C)

0.51 W

Temperature

Storage Range

−65°C to +150°C

Operating Range

−40°C to +85°C

Quiescent Channel (TCASE = 85°C, VDD = 2 V, IDQ =

25 mA, Input Power (PIN) = Off)

93.75°C

Maximum Channel

175°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the channel to case thermal resistance.

Table 7. Thermal Resistance

Package Type

θJC

Unit

CP-8-30

Quiescent, TCASE = 25°C

141

°C/W

Worst Case1, TCASE = 85°C.

175

°C/W

1 Worst case across all specified operating conditions

OUTGAS TESTING

The criteria used for the acceptance and rejection of materials must

be determined by the user and based upon specific component and

system requirements. Historically, a total mass loss (TML) of 1.00%

and collected volatile condensable material (CVCM) of 0.10% have

been used as screening levels for rejection of spacecraft materials.

Table 8. Outgas Testing

Specification (Tested per ASTM E595 -15)

Value

Unit

Total Mass Lost

0.14

%

Collected Volatile Condensable Material

0.01

%

Water Vapor Recovered

0.03

%

RADIATION TESTING

Table 9. Radiation Testing

Specifications

Value

Unit

Maximum Total Dose Available (Dose Rate = 50

rads to 300 rads (Si)/sec)1

30

krads (Si)

No Single Event Latch-Up (SEL) Occurs at

Effective Linear Energy Transfer (LET)2

≤62.4

MeV-cm2/mg

1 Guaranteed by device and process characterization.

2 Limits are characterized at initial qualification and after any design or process

changes that may affect the SEL characteristics but are not production lot test-

ed unless specified by the customer through the purchase order or contract.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

ESD Ratings for ADL8141-CSL

Table 10. ADL8141-CSL, 8-Lead LFCSP

ESD Model

Withstand Threshold (V)

Class

HBM

±500

1B

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.