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ADRF5534BCPZN-R7 数据表(PDF) 10 Page - Analog Devices

部件名 ADRF5534BCPZN-R7
功能描述  3.1 GHz to 4.2 GHz, Receiver Front End
PDF  11 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADRF5534BCPZN-R7 数据表(HTML) 10 Page - Analog Devices

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Data Sheet
ADRF5534
APPLICATIONS INFORMATION
analog.com
Rev. A | 10 of 11
The ADRF5534 has a single power-supply pin (VCC) and one
control pin (T/R). Figure 17 shows the external components and
connections for supply and control pins. The VCC pin is decoupled
with a 100 pF multilayer ceramic capacitor and a 4.7 uF capacitor.
The T/R pin is decoupled with a 100 pF multilayer ceramic capac-
itor. The device pin-out allows the placement of the decoupling
capacitors close to the device. The RF pins (ANT, TERM, RXOUT)
do not require external DC blocking capacitors; all pins are pulled
down to 0 V DC with high-impedance. Refer to Table 5 for details.
Figure 17. Recommended Schematic
RECOMMENDATIONS FOR PRINTED CIRCUIT
BOARD DESIGN
The RF ports are matched to 50 Ω internally and the pinout is
designed to mate a coplanar waveguide (CPWG) with 50 Ω charac-
teristic impedance on the PCB. Figure 18 shows the referenced
CPWG RF trace design for an RF substrate with 10 mil thick
Rogers RO4350 dielectric material. RF trace with 18 mil width and
13 mil clearance is recommended for the 2.7 mil finished copper
thickness.
Figure 18. Example PCB Stack-Up
Figure 19 shows the routing of the RF traces, supply, and control
signals from the device. The ground planes are connected with as
many filled, through vias as allowed for optimal RF and thermal
performance. The primary thermal path for the device is the bottom
side.
Figure 19. PCB Routings
Figure 20 shows the recommended layout from the device RF pins
to the 50 Ω CPWG on the referenced stack-up. The ground pads
are drawn as soldermask defined and the signal pads are drawn
as pad defined. The RF trace from the PCB pad is extended with
the same width and tapered to the RF trace with a 45° angle.
The paste mask is also designed to match the pad without any
aperture reduction. The paste is divided into multiple openings for
the paddle.
Figure 20. Recommended RF Pin Transitions
For alternate PCB stack-ups with different dielectric thickness and
CPWG design, contact Analog Devices, Inc., Technical Support
Request for further recommendations.



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