CS3003

8

DS735F1

4. ORDERING INFORMATION

5. ENVIRONMENTAL, MANUFACTURING, & HANDLING INFORMATION

* MSL (Moisture Sensitivity Level) as specified by IPC/JEDEC J-STD-020.

6. REVISION HISTORY

Part #

Temperature Range

Package Description

CS3003-FS

-40 °C to +125 °C

8-lead SOIC

CS3003-FSZ

-40 °C to +125 °C

8-lead SOIC, Lead Free

-40 °C to +125 °C

8-lead QFN, Lead Free

* Connect thermal die pad to V-.

Model Number

Peak Reflow Temp

MSL Rating*

Max Floor Life

CS3003-FS

240 °C

2365 Days

CS3003-FSZ

260 °C

CS3003-FNZ

Revision

Date

Changes

A0

JAN 2007

Initial Release.

A1

FEB 2007

Corrected diagram on p1.

F1

AUG 2007

Updated to “Final” per QPL process.