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SC3 数据表(PDF) 2 Page - Welwyn Components Limited |
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SC3 数据表(HTML) 2 Page - Welwyn Components Limited |
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2 / 3 page ![]() High Power Chip Resistors SC3 Series © Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com Issue A · 03.02 Welwyn Components 85 Typical Load at rated power: 1000 hours at 70˚C MIL-PRF-55342 1 % R Overload: 6.25 x rated power for 2 seconds MIL-PRF-55342 5 . 0 % R High temperature exposure: MIL-PRF-55342 5 . 0 % R Low temperature operation: MIL-PRF-55342 5 . 0 % R Low temperature storage: -65˚C, 100 hours 5 . 0 % R Moisture: MIL-PRF-55342 5 . 0 % R Temperature cycling: MIL-STD-883 Method 1010 Test condition B 5 2 . 0 % R Thermal shock: MIL-STD-202 Method 107 condition B -65˚C +125˚C R% 0.25 Resistance to solder heat: MIL-STD-202 Method 210 5 2 . 0 % R Shelf life test: 12 months at room temperature 1 . 0 % R Leach resistance: molten solder 250˚C 90 Seconds min. Performance Data Temperature Rise vs Pad Area Construction Resistive thick film material, overglaze and organic protection are screen printed on a 96% alumina substrate. The components are laser trimmed to achieve the required resistance tolerance. Terminations The wrap-around copper terminations have an electroplated nickel barrier and tin-lead solder coating, this ensures excellent ‘leach’ resistance properties and solderability. Chips can withstand immersion in solder at 250˚C for 90 seconds and are suitable for reflow or wave soldering mounting applications. Marking The body protection and marking are resistant to all normal industrial cleaning solvents suitable for printed circuits. Chips are packed and mounted with marking side up. The SC3 Chips are mounted with the actual resistor element mounted face down on its termination pads. 1000 100 10 100mm2 300mm2 1000mm2 Termination Pad Area (each end) 1 watt 2 watt 3 watt Pulse Power Rating 100 10 1 0 . 0 1 0 . 1 1 . 0 Time (sec) The wrap-around terminations have an electroplated nickel barrier and matte tin finish. This ensures excellent ‘leach’ resistance properties and solderability. Issue B · 01.07 |
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