ASM330LHBG1 datasheet(2/130 Pages) STMICROELECTRONICS

2 / 130 page

ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for

the production of micromachined accelerometers and gyroscopes to serve both the automotive and consumer

market. The ASM330LHBG1 is AEC-Q100 compliant and industrialized through a dedicated MEMS production

flow to meet automotive reliability standards. All the parts are fully tested with respect to temperature to ensure

the highest quality level.

The sensing elements are manufactured using ST’s proprietary micromachining processes, while the IC

interfaces are developed using CMOS technology that allows the design of a dedicated circuit, which is trimmed

to better match the characteristics of the sensing element.

The ASM330LHBG1 has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of

±125/±250/±500/±1000/±2000/±4000 dps that enables its usage in a broad range of automotive applications.

The device supports dual operating modes: high-performance mode and low-power mode.

All the design aspects of the ASM330LHBG1 have been optimized to reach superior output stability, extremely

low noise, and full data synchronization to the benefit of sensor-assisted applications like dead reckoning and

sensor fusion.

The ASM330LHBG1 is available in a 14-lead plastic, land grid array (LGA) package.

ASM330LHBG1

DS14080 - Rev 1

page 2/130

ASM330LHBG1 数据表(PDF) 2 Page - STMicroelectronics