LX5501A

Microsemi

Integrated Products Division

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

Page 2

Copyright

© 2004

Rev. 1.1, 2005-07-14

InGAP HBT Gain Block

TM

®

ABSOLUTE MAXI MUM RATI NGS

DC Supply Voltage ............................................................................................6V

Collector Current ........................................................................................100mA

RF Input Power ........................................................................................... 10dBm

Operating Temperature Range ...........................................................-40 to +85

°C

Storage Temperature Range...........................................................-65

°C to 150°C

Peak Package Solder Reflow Temp. (40 second max. exposure) ... 260°C (+0, -5)

Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to

Ground. Currents are positive into, negative out of specified terminal

.

PACKAGE PI N OUT

RF Output

/ VCC

GND

GND

RF Input

GND

1

2

34

5

SE

(Top View)

RoHS / Pb-free 100% Matte Tin Lead Finish

FUNCTIONAL PIN DESCRIPTION

Pin No.

Description

1

Ground

2

Ground

3

RF Input

4

Ground

5

RF Output/VCC Supply

RECOMM END E D O P ERATI NG CONDI T I ONS

LX5501A

Parameter

Symbol

Min

Typ

Max

Units

Supply Voltage (with appropriate external resistor)

VCC

3.5

6

V

Quiescent Current (No RF input)

Icq

10

40

mA

ELECTRI CAL CHA RACTERI S TI CS

Conditions: +25

°C, 5V supply voltage.

LX5501A

Parameter

Symbol

Test Conditions

Min

Typ

Max

Units

GENERAL SPECIFICATIONS (FIG 1. TEST CIRCUIT)

Small Signal Gain

S21

Frequency = 5.8 GHz

11.4

dB

P1dB Compression

P1dB

Frequency = 5.8 GHz

11.5

dBm

Input Return Loss

S11

Frequency = 2.4-6 GHz

-10

dB

Output Return Loss

S22

Frequency = 2.4-6 GHz

-10

dB

Isolation

S12

Frequency = 2.4-6 GHz

-20

dB

Harmonics

Frequency = 5.8 GHz, Pout = 10 dBm

-30

dBC

Quiescent Current

Icq

30

mA