Data Sheet

ADRF6780S-CSL

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 9 of 13

Table 3. Absolute Maximum Ratings

Parameter

Rating

Supply Voltage

VPDT and VPRF

6.5 V

VPBB, VPLO, and VPBI

4.3 V

VP18

2.0 V

Temperature

Maximum Junction

125°C

Operating Range

−40°C to +85°C

Storage Range

−55°C to +125°C

Lead Range (Soldering 60 sec)

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to PCB design and operating

environment. Careful attention to PCB thermal design is required.

θJA is thermal resistance, junction to ambient (°C/W), and θJC, TOP

and θJC, BOT are the top and bottom thermal resistance, junction to

case (°C/W).

Table 4. Thermal Resistance

Package Type1

θJA

θJC, TOP

θJC, BOT

Unit

CP-32-20

32.5

23.0

1.7

°C/W

1 See JEDEC Standard JESD51-2 for additional information on optimizing the

thermal impedance (printed circuit board (PCB) with 3 × 3 vias).

OUTGAS TESTING

The criteria used for the acceptance and rejection of materials must

be determined by the user and based upon specific component and

system requirements. Historically, a total mass loss (TML) of 1.00%

and collected volatile condensable material (CVCM) of 0.10% have

been used as screening levels for rejection of spacecraft materials.

Table 5. Outgas Testing

Specification (Tested per ASTM E595-15)

Value

Unit

Total Mass Lost

0.03

%

Collected Volatile Condensable Material

0.01

%

Water Vapor Recovered

0.03

%

RADIATION FEATURES

Table 6. Radiation Features

Specifications

Value

Unit

Maximum Total Dose Available (Dose Rate =

50 rad (Si)/sec to 300 rad (Si)/sec)1

30

krad (Si)

1 Guaranteed by device and process characterization. Contact Analog Devices,

Inc, Technical Support for data available up to 100 krads.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.

ESD Ratings for ADRF6780S-CSL

Table 7. ADRF6780S-CSL, 32-Lead LFCSP

ESD Model

Withstand Threshold (V)

Class

HBM

±500

1B

CDM

±12501

C3

±5002

C2a

1 For all pins except the RF pins (RFOP, RFON, BBQN, BBQP, BBIP, BBIN,

IFIN, IFIP, LOIN, and LOIP).

2 For all pins.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.