5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VKA

Cathode voltage(2)

20

V

IK

Cathode current

–25

80

mA

Iref

Reference current

–0.05

3

mA

TJ

Operating virtual junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Voltage values are with respect to the anode terminal, unless otherwise noted.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

See(1)

MIN

MAX

UNIT

VKA

Cathode voltage

VREF

18

V

IK

Cathode current (continuous)

0.1

70

mA

TA

Operating free-air temperature

TLVH43x_C

0

70

°C

TLVH43x_I

–40

85

TLVH43x_Q

–40

125

(1)

Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient

temperature is PD = (TJ(max) – TA) / θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.

5.4 Thermal Information

THERMAL METRIC(1)

TLVH43xx

UNIT

DCK

(SC70)

PK

(SOT-89)

DBV

(SOT-23)

DBZ

(SOT-23)

LP

(TO-92)

6 PINS

3 PINS

5 PINS

3 PINS

3 PINS

RθJA

Junction-to-ambient thermal resistance

259

52

206

206

140

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

87

9

131

76

55

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

TLVH431, TLVH431A, TLVH431B, TLVH432, TLVH432A, TLVH432B

SLVS555N – NOVEMBER 2004 – REVISED JUNE 2024

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