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MICRF112 数据表(PDF) 39 Page - Microchip Technology |
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MICRF112 数据表(HTML) 39 Page - Microchip Technology |
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39 / 46 page ![]() MICRF112 Package Information Data Sheet © 2024 Microchip Technology Inc. and its subsidiaries DS70005554A - 39 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: © 2022 Microchip Technology Inc. Saw Singulated with Pullback Leads REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. 2. 3. Pin 1 visual index feature may vary, but must be located within the hatched area. Package is saw singulated Dimensioning and tolerancing per ASME Y14.5M Number of Terminals Overall Height Terminal Width Overall Width Terminal Length Exposed Pad Width Terminal Pullback Pitch Standoff Units Dimension Limits A1 A b E2 L1 e L E N 0.40 BSC 0.05 REF 1.05 0.15 0.15 0.45 0.00 0.20 0.20 1.10 0.50 – 2.00 BSC MILLIMETERS MIN NOM 10 1.15 0.25 0.25 0.55 0.05 MAX K 0.20 REF Terminal-to-Exposed-Pad Overall Length Exposed Pad Length D D2 1.35 2.00 BSC 1.40 1.45 Sheet 2 of 2 Microchip Technology Drawing C04-574 Rev A |
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