Ordering information

EMIF06-mSD01F2

6/7

Figure 12.

Flip-Chip Tape and reel specification

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Note:

More packing information is available in the application notes:

AN1235: “Flip-Chip: Package description and recommendations for use”

AN1751: "EMI Filters: Recommendations and measurements"

5

Ordering information

6

Revision history

Dot identifying Pin A1 location

User direction of unreeling

All dimensions in mm

4 +/- 0.1

4 +/- 0.1

Ø 1.5 +/- 0.1

0.73 +/- 0.05

Ordering code

Marking

Package

Weight

Base qty

Delivery mode

EMIF06-mSD01F2

HJ

Flip-Chip

5.3 mg

5000

Tape and reel 7”

Date

Revision

Description of Changes

02-Feb-2007

1

First issue.