PD77020

Package Information

Data Sheet

© 2023 Microchip Technology Inc. and its subsidiaries

DS60001824A - 12

Figure 4-3. PD77020 Top-Layer Copper

Figure 4-4. PD77020 Paste Mask

Note: The contract manufacturer has latitude to modify the solder paste stencil for

manufacturability reasons. The solder paste stencil covers 65% to 80% of the thermal pad and

must not allow solder to be applied to the thermal vias under the QFN package using any method

they deem appropriate. Any design must be subject to system validation and qualification prior to

commitment to mass production of field deployment. Use a 5 mil stencil.

4.4

Recommended Solder Reflow Information

The recommended solder reflow information is as follows:

• RoHS 6/6