data sheet

CABGA/CTBGA/CVBGA

Features:

Thermal Resistance:

Reliability:

Cutting edge technology and expanding

package offerings provide a platform from

prototype-to-production.

• Full, in-house design

• Square or rectangle packages available

• 4 mm to 21 mm body size available

• 8 to 449 ball counts

• 0.5, 0.65, 0.75, 0.80 & 1.0 mm ball pitch available

• JEDEC MO-216 compliant for 0.8 mm and

1.0 mm ball pitch

• JEDEC MO-195 compliant for 0.5 mm & 0.65 mm

ball pitch

• PB free and Green package available

• Daisy Chain packages available

• Short traces for excellent electrical inductance

• Low inductance (modeled data)

1.4nH (1.0 mm trace length)

4.1nH (5.0 mm trace length)

Theta JA at 1.0 Watt and 0 airflow (°C/Watt)

CABGA

CTBGA

CVBGA

8 x 8

37.28

36.45

37.52

10 x 10

19.86

29.04

26.7

11 x 11

29

N/A

N/A

15 x 15

20.1

N/A

N/A

19 x 19

17.04

N/A

N/A

Amkor assures reliable performance by

continuously monitoring key indices:

• Moisture sensitivity

JEDEC Level 2 @ 240 °C

characterization

JEDEC Level 3 @ 260 °C

85 °C/85% RH, 168 hours

• Temp/humidity

85 °C/85%, 1000 hours

• High temp storage

150 °C, 1000 hours

• HAST

130 °C/85% RH, 96 hours

• Temp cycle

-55/+125 °C, 1000 cycles

ChipArray® Packages:

Amkor’s ChipArray® packages are laminate-

based Ball Grid Array (BGA) packages that are

compatible with established SMT mounting

processes. The near-chip-size standard outlines

offer a broad selection of ball array pitch, count,

and body sizes. (See table on back.) In addition

to the standard core ChipArray package (CABGA),

Amkor offers thin core ball grid array packages

(CTBGA and CVBGA) which, coupled with a thin

mold cap, achieve package thicknesses down to

1.0 mm max. By utilizing a thin core laminate,

much denser routing can be achieved, thereby

enabling more I/Os in a given footprint. Amkor

ChipArray packages, regardless of body size and

thickness, utilize the same, flexible capacity which

assures economical packaging solutions. Further,

high volume processes and innovative design

assure high quality and cutting edge technology.

Due to their small size and I/O density, Amkor’s

ChipArray product family is an excellent choice for

new devices requiring a small footprint size and

low mounted height.

Applications:

The ChipArray package family is applicable for

semiconductors such as memory, analog, ASICs,

RF devices and simple PLDs requiring a smaller

package size than conventional PBGAs.

ChipArray packages fill the need for low cost,

minimum space and high speed requirements

of mobile phones and pagers, notebook and

subnotebook personal computers, PDAs and

other wireless systems.

LAMINATE

www.amkor.com

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

TO VIEW THE MOST CURRENT PRODUCT INFORMATION

.

DS550N

Rev Date: 01’07