data sheet

LCC

Features:

CERAMIC

www.amkor.com

VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND

TO VIEW THE MOST CURRENT PRODUCT INFORMATION

Leadless Chip Carrier

Package (LCC)

Amkor Technology is committed to continuing to

service this long established standard industry

package. This surface mount package consists of a

co-fired ceramic base that has metalized

terminals / pads on the sides and bottom of the

package. An LCC package has terminals / pads on

all four edges of the package. The lid for this

package can be either ceramic "frit sealed" or

metal "solder sealed". This package provides a

hermetic environment for the IC inside.

Applications:

This IC package technology allows application and

design engineers to maximize the performance

characteristics of semiconductors (silicon, GaAs and

S.A.W.). These packages enable end products

(pagers, portable audio/video, disc drives, radio,

IF & RF devices/components, telecom) to be

reduced in size and weight. Semiconductor

families such as operational amplifiers, drivers,

optoelectronics, controllers, logic, analog, memory,

comparators and more using BiCMOS, CMOS or

other silicon/GaAs/S.A.W. technologies are well

addressed by the LCC product family.

The LCC offers a variety of features. From

standard industry, Amkor provides a platform from

prototype-to-production:

• Flexible lead / pin counts

• Variety of body sizes

• Hermetic package

• Exceptional thermal and electrical

performance by design

• Multi-layer, ground / power

• Cavity Up / Cavity down configurations

• Cavity package

DS810

Rev Date: 08’02

.