PLCC NOMINAL PACKAGE DIMENSIONS

PLCC

LEADFRAME

Process Highlights

Die thickness (max)

25 mils

Strip solder plating

85/15 Sn/Pb or

100% Sn

Strip marking

Laser/pad/offset

Lead inspection

Optical

Pack/ship options

Bar code

Test Services

• Program/generation/conversion

• Product engineering

• Wafer sort

• 256 pin x 20 MHz test system available

• -55 °C to +165 °C test available

• Burn-in

Shipping

Clear antistatic tube 20 inches

data sheet

With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or

damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard

terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.

www.amkor.com

Configuration Options:

Cross-section PLCC

Body

Amkor

JEDEC

Qty Per

Lead Count

Body Size

Thickness

Lead Pitch

Lead Form

Dwg No.

Dwg No.

Tube

Square

20

.352 x .352

0.152

0.05

N/A

00060

MS-018

46

28

.452 x .452

0.152

0.05

N/A

00060

MS-018

37

44

.652 x .652

0.152

0.05

N/A

00060

MS-018

26

52

.752 x .752

0.152

0.05

N/A

00060

MS-018

23

68

.952 x .952

0.150

0.05

N/A

00060

MS-018

18

84

1.152 x 1.152

0.150

0.05

N/A

00060

MS-018

15

Rectangular

32

.452 x .552

0.109

0.05

N/A

00061

MS-016

30