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Silver Wirebonding

Note: Numbers in the table above are based on wire diameter of 0.8 mil

Ag-Alloy

Au

Au PCC

Impact

Wire Cost

Lower Cost

Expensive

Lowest Cost

Au PCC And Ag-Alloy Wires Are Significantly Cheaper Than Au Wire

FAB Hardness

Soft

Soft

Hard

Harder Materials Cause Cratering, Bond Pad Crack

Process Windows

(Force, Power, Time)

Wide

Wide

Narrow

Wider Process Window Improves Manufacturability For Devices With

Fragile Bond Pad Structures

AI Splash

Minimal

Minimal

More

Less Aluminum Splash Is Better For Fine Pitch And Small BPO

Ultra-low Loop Capability

Excellent

Excellent

Limited

Ultra-low Loop Capability Allows Thinner Packages

Resistivity

Good

Better

Best

Lower Resistivity Is Better For High Current Carrying Applications

Ag-Alloy Wire Readiness

Ag-Alloy

Au

Au PCC

Physical Properties

Hardness (Hv)

Free Air Ball (EFO = 120 mA)

50~60

44~49

70~80

HAZ

50~60

44~49

55~65

Wire

60~70

49~55

60~70

HAZ Length (µm)

60~80

60~80

80~100

Density (g/cm2)

10.58

19.2

8.98

Elastic Modulus (Gpa)

60~70

80~90

90~100

Recrystallization Temp. (°C)

500~550

500~550

500~550

Melting Point (°C)

980~1010

1060~1080

1080~1100

Fusing Current (A, Length = 10 mm)

0.44

0.47

0.58

Resistivity (uΩ cm) @ 20°C

3.3

2.9

1.9

Thermal Conductivity (W/mk)

429

317

401

Coefficient Of Thermal Expansion (0 ~ 100°C, ×10-6/K)

19

14

17

Elongation (%)

2~12

2~7

3~17

Material Composition

Purity (%)

>95%

>99%

99.98

Properties of Different Wire Materials