PowerCSP™ is an innovative chip scale power transistor package.

It has a simple structure, excellent electrical and thermal properties

and high-density form factor that suits the challenges of discrete or

integrated packaging.

PowerCSP™

DATA SHEET | POWER PRODUCTS

Applications

PowerCSP™ is suitable for power applications designed for low

on-resistance and high-speed-switching MOSFETs such as:

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Telecom/Data centers

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Electric and hybrid electric vehicles

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DC/DC conversion

Reliability Qualification

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Under development in 5 x 6 mm package body

Test Services

Amkor offers full turnkey business for all power discrete products with the

capability to test various types of power devices including MOSFETs, bipolar

transistors, IGBTs, diodes and regulator ICs/intelligent power devices.

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Amkor power discrete test capability

▷ Static test (DC)

▷ Dynamic test (AC, switching/Trr, capacitance/Rg)

▷ Destruction test (inductive load/VSUS, latch up test,

surge, isolation/VIL)

▷ Thermal resistance (ΔVDS, ΔmV, etc.)

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Program generation/conversion

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Failure analysis

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Available test/handling technology

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Integrated marking, vision inspection and tape & reel services

Standard Materials

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Leadframe: Bare copper (C19210)

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Die attach: Ag adhesive, Ag sintering, solder or hybrid sintering material

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Mold compound: Halogen free

Shipping

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Tape and reel packing

▷ 3000 pcs per reel

▷ Tape width 12 mm

▷ Reel Ф = 330 mm

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Barcode packing label

FEATURES

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Low resistance/inductance packaging

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Reduced form factor, Chip Scale

Package (CSP)

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CMOS, GaN and SiC compatible

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Integrated power building block

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Reduced thermal and electrical

interfaces

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Direct connection of the source or

drain to the PCB

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High percent of conductive material

within the volume of the package of

30-70%

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Low resistance (Rds), low inductance

(Lds) and good capacitive (Ciss)

performance compared to other

discrete packages

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Custom and standard pin layouts in a

dual-sided power package

NEW DEVELOPMENTS

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Simple package structure eliminates

clip and wire for a direct source/drain/

gate connection

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Eliminates lossy interfaces compared

to traditional discrete packaging

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Maximized source and drain

connectivity area