DATA SHEET | POWER PRODUCTS

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This package features

▷ Very-low parasitics and inductances resulting in world-class package

level RDS(on)

▷ Outstanding EMI behavior and excellent thermal performance

▷ Space-saving designs ranging from 3 x 3 mm to 8 x 8 mm

▷ Numerous multi-die, multi-clip with wire variations available

▷ Capable of supporting numerous GaN applications/solutions

▷ Green materials: Pb-free plating and halogen-free mold compound

Applications

PQFN is suitable for medium-power applications, designed for low

on-resistance and high-speed switching MOSFETs.

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Servers

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Portable electronic devices

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Notebook PCs

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Automotive

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Telecom

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Light Electric Vehicles (LEV)

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Battery management

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IoT

Test Services

Amkor offers full turnkey business for all power products, with the

capability to test various types of power devices including MOSFETs, bipolar

transistors, IGBTs, diodes and regulator IC/intelligent power devices.

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Amkor power test systems

▷ ETS88

▷ ETS364

▷ ETS800

▷ PowerTech (typically targeted for discrete solutions)

▷ Test capability examples

⨠ Static test (DC)

⨠ Dynamic test (AC, switching/Trr, capacitance/Rg)

⨠ Destructiontest(inductiveload/VSUS,Ilatch,surge,isolation/VIL)

⨠ Thermal resistance (ΔVDS, ΔmV, etc.)

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Program generation/conversion

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Failure analysis

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Full complement of handling technology

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Integrated marking, vision inspection and tape & reel services

The PQFN (PowerQuad® Flat No-Lead) is a highly efficient space-

saving package designed for a wide range of higher power

applications. A “Smart Power” option in today’s power electronic

world, the PQFN is a step above the standard low-power sawn QFN

package, while being more flexible (IC control die integrated designs)

than other power discrete packages.

PQFN

PROCESS HIGHLIGHTS

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Die attach: 55 µm thin die pick up

capability

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Plating: 100% Matte Sn

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Roughened copper leadframe with

selective Ag

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Interconnect: Cu clip technology

for better thermal and electrical

performance

NEW DEVELOPMENTS

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Wettable flank option available and

well suited to the automotive market

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Package available with dual exposed

heatsink options

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Thin wafer dicing with narrow saw

streets