TLE2141, TLE2141A, TLE2141Y

EXCALIBUR LOW-NOISE HIGH-SPEED

PRECISION OPERATIONAL AMPLIFIERS

SLOS062D – NOVEMBER 1990 – REVISED AUGUST 1994

5–2

POST OFFICE BOX 655303

description (continued)

The design incorporates an input stage that simultaneously achieves low audio-band noise of 10.5 nV/

√Hz with

a 10-Hz 1/f corner and symmetrical 40-V/

µs slew rate typically with loads up to 800 pF. The resulting low

distortion and high power bandwidth are important in high-fidelity audio applications. A fast settling time of

340 ns to 0.1% of a 10-V step with a 2-k

Ω/100-pF load is useful in fast actuator/positioning drivers. Under similar

test conditions, settling time to 0.01% is 400 ns.

The devices are stable with capacitive loads up to 10 nF, although the 6-MHz bandwidth decreases to 1.8 MHz

at this high loading level. As such, the TLE2141 and TLE2141A are useful for low-droop sample-and-holds and

direct buffering of long cables, including 4-mA to 20-mA current loops.

The special design also exhibits an improved insensitivity to inherent integrated circuit component mismatches

as is evidenced by a 500-

µV maximum offset voltage and 1.7-µV/°C typical drift. Minimum common-mode

rejection ratio and supply-voltage rejection ratio are 85 dB and 90 dB, respectively.

Device performance is relatively independent of supply voltage over the

±2-V to ±22-V range. Inputs can

may flow out of each input exceeding the lower common-mode input range. The all-npn output stage provides

can sustain shorts to either supply since output current is internally limited, but care must be taken to ensure

that maximum package power dissipation is not exceeded.

to the device. Open-loop propagation delay with TTL supply levels is typically 200 ns. This gives a good

indication as to output stage saturation recovery when the device is driven beyond the limits of recommended

output swing.

Both the TLE2141 and TLE2141A are available in a wide variety of packages, including both the

industry-standard 8-pin small-outline version and chip form for high-density system applications. The C-suffix

devices are characterized for operation from 0

°C to 70°C, I-suffix devices from –40°C to 105°C, and M-suffix

devices over the full military temperature range of – 55

°C to 125°C.

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IN –

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D, JG, OR P PACKAGE

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NC – No internal connection

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NC

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NC

NC

IN –

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FK PACKAGE

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